规格书 |
|
RoHS |
RoHS Compliant |
评论 |
Mounting clip does not increase overall heat sink height.; Heat sink assembly i |
RoHSELV合规性 |
RoHS compliant, ELV compliant |
Lead Free Solder Processes |
Not relevant for lead free process |
表面处理 |
Black Anodize |
高(毫米( ) ) |
31.75 [1.250] |
直径(毫米) |
34.92 [1.375] |
包装尺寸(毫米( ) ) |
27 [1.064] |
材质 |
Aluminum |
设备类型 |
BGA |
可燃性等级 |
UL 94V-0 |
散热器类型 |
10 Fin Radial |
适用于 |
BGA Semiconductor Packages |
行 |
ChipCoolers |
产品类型 |
Heat Sink |
RoHSELV符合记录 |
Converted to comply with RoHS directive |